Infrastructure

Leveraging our solid industrial foundation to build a future-ready ecosystem for compound semiconductor technology and services.

Core Infrastructure

"Adhering to ISO international standards, we operate Class 100/1000 cleanrooms. Through advanced equipment and precision environmental controls, we ensure high yields, superior reliability, and secure production output."

数据中心
FMCS (Facility Monitoring & Control System)
Epitaxy Equipment
Packaging Equipment
Smart Factory:Designed and constructed in compliance with ISO Class 8 (100K), Class 7 (10K), and Class 6 (1K) standards, the facility features a total cleanroom area of 25,907 sqm. It is equipped with an advanced FMCS (Facility Monitoring & Control System) to ensure high-standard, stable operation of the production environment.
Advanced Equipment Configuration:We have deployed advanced production equipment for both epitaxy and packaging processes. This includes multi-series MOCVD systems from Aixtron and Veeco, along with epitaxial wafer inspection tools and chip packaging lines. Furthermore, we are actively preparing to establish front-end chip process lines, which will incorporate lithography, etching, and thin-film deposition equipment.