Epi Wafer
Packaging
GaAs Epitaxial Wafer
GaN Epitaxial Wafer
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VCSEL COS Package
VCSEL TO Package
APD TO Package
We focus on your specific needs, providing tailored high-performance compound semiconductor materials and products.
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Package size: 3.5 * 3.5 * 1.35mm.
Adopting highly reliable ceramic substrate packaging, with stable performance.
Welding method: eutectic/fixed.
Lead free packaging, compliant with ROHS standards.
Small size, low power consumption, and good directionality.
